SJ Semiconductor Signs $340 Million Series C+ Financing
Shanghai – April 10, 2023 – Cooley advised SJ Semiconductor Corporation (SJSemi), a semiconductor foundry, on its $340 million Series C+ financing, with a post-money valuation of close to US$2 billion. Shanghai-based private equity and M&A partner Ruomu Li, associate Wenlan Geng and legal consultant Teresa Yang led the Cooley team; associates Lanru Qiao, Xia Jiang and Zixiang Liu, along with legal consultant Sherlyn Qu, also provided support for general corporate matters of SJSemi.
The Series C+ round was signed on March 29, 2023, by the initial group of investors, including Legend Capital, Goldstone Investment, INCE Capital, Jade Stone Venture, Shang Qi Capital, Leafoison Capital, TCL Capital, China Fortune-Innovation Capital and GLP-C&D Capital. Existing shareholders Oriza Rivertown and Oriza Hua Capital also participated in the round.
SJSemi is headquartered in Jiangyin, China, with branches in Shanghai, China, and San Jose, California.
SJSemi is the pioneer of the 12-inch MEOL (middle-end-of-line) foundry in China, which is well-known for its 12-inch high-density bumping, wafer level chip scale packaging (WLCSP) and testing service, and serves top integrated circuit companies globally. Utilizing bumping and redistribution layer (RDL) technologies and leveraging its advantage of front-end fab management and a quality system, SJSemi provides high-performance advanced packaging based on silicon interposer, fan-out wafer and substrate to satisfy increasing strong demand in markets such as smart phone, networking, data center, artificial intelligence and the automotive industry. The Series C+ financing will further enhance SJSemi’s comprehensive technical strength in the field of high-performance advanced packaging.
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